Custom Semiconductor Hybrid and Monolithic Assembly

We Offer the Most Flexibility for Your Micro-Electronic Assembly Needs

VPT Components offers a wide range of micro-electronic assembly options from single die assemblies to multi-chip modules, from single and low quantity prototypes to high volume production runs.

Our manual die mount and wire bond line gives us the capability to create the exact part you need. Our automatic programmable wire bonders provide the repeatability that high-production runs require. In process integrity tests include bond pull, ball shear, and die shear.

You can trust your custom assembly and screening requirements to VPT Components with both of our manufacturing sites certified to the JANS quality level of MIL-PRF-19500. Our quality systems are certified to MIL-PRF-19500 and ISO9001:2015 with process monitor controls in place for all critical process steps.

Component Attach Assembly Services

  • Die, IC’s Substrates, COB Assemblies
  • Epoxy paste, Film and Preform
  • Conductive & Non-Conductive Adhesives
  • Eutectic, Solder, and Hot Gas
  • Bond Pull
  • Ball Shear
  • Thermo-Electric Spot Welding

Wire Bond

  • Automatic & Manual
  • Gold Ball from .0007”-.002”
  • Gold Wedge and Ribbon
  • Aluminum Wedge from .001”-.020”
  • Die Shear
  • Die-Wafer
  • Inspection
  • Plasma Clean
  • Cleaning-Degreasing

Hermetic Sealing

  • Solder Reflow
  • Seam Seal
  • Cap Weld

Non-Hermetic

  • Encapsulation-Potting
  • Epoxy Seal
  • Hand Soldering
  • Feed-thru Installation
  • Connector Installation

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